Want China Times, CNA 2014-01-09
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| A worker inspects an IC wafer at a lab located in the Hsinchu Science Park in northern Taiwan. (Photo Courtesy of TSMC) |
Taiwan's
National Applied Research Laboratories (NARL) unveiled on Tuesday a new
three-dimensional integrated circuit (3D-IC) technology that it said can be
used to make "super chips."
The
laboratory said it has spent NT$500 million (US$16.6 million) over the past 10
years developing the "Monolithic 3D-IC" technology, which chip makers
can use to stack multiple layers of chips, allowing for more functions at a
lower power consumption level.
"We
have developed a very critical core technology in line with industrial
trends," said Shieh Jia-min, who is in charge of the project.
Currently,
only French research-and-technology organization Leti is working on a similar
Monolithic technology, but the NARL can provide better performance and offer
more components with its solution, Shieh said.
The new
technology enables 150 layers of chips to fit in space once used to stack a
mere two chips using traditional technology, and helps improve signal
propagation speed, provides a higher order of connectivity and offers new
design possibilities, Shieh said.
Shen
Chang-hong, another researcher on the team, told CNA that a Taiwanese flat
panel maker is currently collaborating with the team and plans to release new
products using the technology in April at the earliest.
"We're
promoting technical cooperation at the moment, and looking forward to
technology transfer in the future," Shen said.
The
laboratory plans to enhance the technology and expects it to mature to a level
suitable for use by memory chip makers or contract chip makers within five
years, he said.
The
technology can benefit the telematics, aerospace, cloud computing and
information and communications sectors, according to researchers.
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